Trends and Forecast for the Global Semiconductor Material for Harsh Environment MarketTrends, opportunities and forecast in semiconductor material for harsh environment market to 2027 by material (silicon, silicon on insulator, silicon germanium, silicon carbide, and gallium nitride), application (high temperature, wide range of temperature, intense radiation, and high pressure), end use (industrial, aerospace and defense, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)Lucintel's latest market report analyzed that semiconductor material for harsh environment provides attractive opportunities in the industrial, aerospace and defense, and others. The semiconductor material for harsh environment market is expected to grow with a CAGR of 7%-9%. In this market, gallium nitride is the largest segment by material.
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Based on material, the semiconductor material for harsh environment market is segmented into silicon, silicon on insulator, silicon germanium, silicon carbide, and gallium nitride. The gallium nitride segment accounted for the largest share of the market in 2020 due to its better properties that helps to withstand high temperature, high voltage, and caustic atmosphere applications.
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The semiconductor material for harsh environment market is marked by the presence of several big and small players. Some of the prominent players offering semiconductor material for harsh environment include ABB, Honeywell International, Rolls-Royce, Wartsila, Northrop Grumman, Marine Technologies, Ulstein, Kongsberg, and others.
This unique research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link helpdesk@lucintel.com.
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